Diode encapsulation is a common operation in the production of electronic components. It refers to fixing circuit glue on other devices with glue. During this period, the quantity of sealing glue should be strictly controlled. The automatic operation of sealing dispensing machine is used to complete diode encapsulation with good quality and high efficiency. It can set parameters for batch glue encapsulation. At the same time, it can also glue batch semiconductor and so on. Stable and highly consistent. It is more advantageous to fix the package on the device without dropping, which is related to the application of the screw dispensing valve.
Microdiode Packaging Coating
Need for Diode Coating Packaging
331 Non-punctuating Rubber Machine
Diode structure generally needs small amount of sealant meticulously and evenly. It is difficult for ordinary rubber valves to control the amount of sealant and ensure the uniformity of adhesive points. This is a special requirement of precision electronic packaging coating. To meet this practical need, a screw dispensing valve is provided to help users continuously control the precise amount of sealant. It can be installed in a sealant dispensing machine to control the amount of sealant and driven by a screw. Uniform and quantitative glue quantity control glue coating and glue production, while electric drive stability and high efficiency, better complete the production of small products such as diode packaging and semiconductor glue coating.
According to the actual situation, the sealing dispensing machine and assembly screw dispensing valve are widely applicable and practical for batch diode packaging or semiconductor coating.